Our Research Areas

Wireless Power and MHz-Microwave Power Delivery

The full spectrum of wireless power systems from MHz to mmWave; application-driven and across-TRL scale.

• High-TRL RF power delivery and RF-powered sensing, now commercialised via RX WaTT Ltd.
• Fully integrated CMOS wireless-powered systems including rectifiers and backscattering modulators.
• Near-field waveguides for power delivery.
• Implantable and through-body wireless power delivery and their therapeutic applications.
We are active in horizon mapping and community leadership activities, including co-authoring 4 Invited Roadmaps/Features and leading a UK-specific focus (IEEE Microw. Mag'25).

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Electromagnetic Sensing: Materials and Devices

Enabling wireless networks to be more efficient and operate uninterrupted in new user-centric applications.

• EM/RF dielectric spectroscopy applied to novel functional materials (Nature Comm.'24, Adv. Science'25).
• RF localisation, ranging, and tracking (IEEE Journal Spec. Areas Sensors'25)
• Chipless resonators for identification and sensing; circular and sustainable materials (IEEE Trans. Microw.'25).
• Antenna-based sensors for environmental and human activity monitoring (IEEE Open Journal Antennas Propag.'22).

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Wireless Human Interfaces and E-Textiles

Wireless and battery-less sensors using electromagnetics/materials/smart materials interactions.

• Robust, microwave-enabled wearables and e-textiles (IEEE Journal of Microw.'22).
• Multi-port antenna design for RF sensing.
• Body-centric antenna-based sensing and ML-enabled tracking.
• Materials and surfaces for EM wave manipulation, shielding, and modulation.

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Advanced RF Packaging and Heterogenous Integration

Applying scalable additive manufacturing, microfabrication, and deposition methods to meet the requirements of emerging high-density and high-speed interconnects in telecommunications and computing:
• RF-THz interconnects using additive manufacturing.
• 2.5D and 3D integration of MMICs and RFICs.
• High-speed (100 GHz+) and wireless interposer design and fabrication on glass and silicon.

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Sustainable and Circular Electronic Materials

Integrating design-for-circularity, "green" materials, and recycling and re-use for next-generation electronics.
• Materials and fabrication for material circularity and IC re-use, including RF systems (IEEE Trans. Circuits Sys.'25).
• Biodegradable and bio-sourced abundant materials for low-waste wireless sensors.
• Life Cycle Assessment (LCA) of RF systems and LCA-driven electronics design (IEEE Journal Microw.'24).
• Applied research with industry on scaling biodegradable/sustainable elctronics to wireless/RF (Whitepaper'25).

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